Technical Capabilities

Sonic Tech India – Printed Circuit Board Manufacturing Capabilities

Sonic Tech. (India), Inc.

Space 125,000 Square Feet
Inner Layer
Trace/Space
.005/”.005″
Outer Layer
Trace/Space
.005″/.005″
Minimum Drilled Hole .010″
Number of Layers 1-10 Layers
Minimum SMT Pitch 16 mil
Layer to Layer
Registration
+/-.005″
Soldermask
Registration
LPI +/-.0025″
Feature to Feature
Registration
+/-.003″
Maximum Finished
Board Size
16 x 22
Board Thickness
Tolerance
+/-.005 (.062)
Board Flatness
Tolerance
.007 (in./in.)
HASL Yes
LF/HASL Yes
ENIG Capability Yes
Immersion Silver
Capability
Yes
Electrical
Test Capability
Netlist Test – Grid and Flying Probe
Laser Photo Plotting In House
AOI Capability Yes
Controlled Impedance Yes
Blind/Buried Via’s N/A
UL Line Approval .004″ Line/Space
Military Approval N/A
ISO Certified Yes; ISO-9001:2015
ITAR Certified No