Surface Finishes

National Technology can provide your circuit board surface finish of choice

Specification
Electroless Nickel/Immersion gold (ENIG) Finish

  • Standard deposition of 3 – 5 micro inches Gold over 100 micro inches of Nickel
  • Best Lead Free choice for shelf life and solderability without “using a heat cycle” during board manufacturing.
Lead Free Hot Air Solder Level

  • SN100C Lead Free Solder Process
Conventional Hot Air Solder Level

  • Not to be used on RoHS Compliant Product
Immersion Silver

  • MacDermid Sterling Metallic Solderability Preservative.
OSP

  • Enthone CU 106