Electroless Nickel/Immersion Gold (ENIG) Finish

  • Standard deposition of 2 micro inches Gold over 118 micro inches of Nickel
  • Best Lead Free choice for shelf life and solderability without “using a heat cycle” during board manufacturing.

Lead Free Hot Air Solder Level

  • SN100C Lead Free Solder Process

Conventional Hot Air Solder Level

  • 63/37 solder
  • Not to be used on RoHS Compliant Product

Immersion Silver

  • Metallic Solderability Preservative.