Electroless Nickel/Immersion Gold (ENIG) Finish
- Standard deposition of 2 micro inches Gold over 118 micro inches of Nickel
- Best Lead Free choice for shelf life and solderability without “using a heat cycle” during board manufacturing.
Lead Free Hot Air Solder Level
- SN100C Lead Free Solder Process
Conventional Hot Air Solder Level
- 63/37 solder
- Not to be used on RoHS Compliant Product
- Metallic Solderability Preservative.