We strive for seamlessness in our two printed circuit board manufacturing facilities, but there are some distinctions in process capability between our Rolling Meadows facility and our India facility:
|
National Technology, Inc |
Sonic Tech. (India), Inc. |
|
|---|---|---|
| Space | 57,000 Square Feet | 100,000 Square Feet |
| Inner Layer Trace/Space |
.004″/.004″ | .005/”.005″ |
| Outer Layer Trace/Space |
.004″/.004″ | .005″/.005″ |
| Minimum Drilled Hole | .010″ | .010″ |
| Number of Layers | 2-18 Layers | 1-10 Layers |
| Minimum SMT Pitch | .016″ | .020″ |
| Layer to Layer Registration |
+/-.005″ | +/-.005″ |
| Soldermask Registration |
LPI +/-.0025″ | LPI +/-.0025″ |
| Feature to Feature Registration |
+/-.003″ | +/-.003″ |
| Maximum Finished Board Thickness |
.125″ | .125″ |
| Board Thickness Tolerance |
+/-.005″ (.062) | +/-.007 (.062) |
| Board Flatness Tolerance |
.007 (in./in.) | .007 (in./in.) |
| ENiG Capability | Yes | Yes |
| Immersion Silver Capability |
Yes | Yes |
| Electrical Test Capability |
Net List/Clam Shell/MPT/Grid | Net List/Clam Shell/MPT/Grid |
| Laser Photo Plotting | In House | In House |
| AOI Capability | Inner layer (I/L) | Inner layer (I/L) |
| Controlled Impedance | Yes | N/A |
| Blind/Buried Via’s | Blind/Buried | N/A |
| UL Line Approval | .004″ Line/Space | .004″ Line/Space |
| Military Approval | N/A | N/A |
| ISO Certified | Yes; ISO-9001-2008 | Yes; ISO-9001-2008 |