Our circuit board manufacturing process adheres to the following attributes:

• Max panel size – 16” x 22”
• Overall thickness – .015” -.125”
• Maximum number of layers – 18
• Copper weight – UL approved to 4oz. finish
• Controlled impedance  – +/- 10%
• Panel separation either rout or score or combination of both
• Standard and High Temp FR4 laminates
• High performance materials including Rogers 4003 and 4350