We strive for seamlessness in our two printed circuit board manufacturing facilities, but there are some distinctions in process capability between our Rolling Meadows facility and our India facility:

National Technology, Inc

Sonic Tech. (India), Inc.

Space 56,500 Square Feet 125,000 Square Feet
Inner Layer
Trace/Space
.004″/.004″ .005/”.005″
Outer Layer
Trace/Space
.004″/.004″ .005″/.005″
Minimum Drilled Hole .010″ .010″
Number of Layers 1-18 Layers 1-10 Layers
Minimum SMT Pitch 10 mil 16 mil
Layer to Layer
Registration
+/-.005″ +/-.005″
Soldermask
Registration
LPI +/-.0025″ LPI +/-.0025″
Feature to Feature
Registration
+/-.003″ +/-.003″
Maximum Finished
Board Size
16 x 22 16 x 22
Board Thickness
Tolerance
+/-.005″ (.062) +/-.005 (.062)
Board Flatness
Tolerance
.007 (in./in.) .007 (in./in.)
HASL Yes Yes
LF/HASL Yes Yes
ENIG Capability Yes Yes
Immersion Silver
Capability
Yes Yes
Electrical
Test Capability
Netlist Test – Grid and Flying Probe Netlist Test – Grid and Flying Probe
Laser Photo Plotting In House In House
AOI Capability Yes Yes
Controlled Impedance Yes Yes
Blind/Buried Via’s Blind/Buried N/A
UL Line Approval .004″ Line/Space .004″ Line/Space
Military Approval N/A N/A
ISO Certified Yes; ISO-9001-2015 Yes; ISO-9001-2015
ITAR Certified Yes No