Specification

Electroless Nickel/Immersion Gold (ENIG) Finish

• Standard deposition of 2 micro inches Gold over 118 micro inches of Nickel
• Best Lead Free choice for shelf life and solderability without “using a heat cycle” during board manufacturing.

Lead Free Hot Air Solder Level

• SN100C Lead Free Solder Process

Conventional Hot Air Solder Level

• 63/37 solder
• Not to be used on RoHS Compliant Product

Immersion Silver

• Metallic Solderability Preservative.